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XCM410 Series
2 Channel Voltage Detector (Sense Pin separated from VDD)
ETR2426_003
GENERAL DESCRIPTION
The XCM410 series is a multi combination module IC which comprises of two voltage detectors, XC6108 and XC6109 series. The two detectors inside are highly precise, low power consumption voltage detectors using laser trimming technology. The sense pin (VSEN) for channel 1 (VOUT1) is separated from power supply (VIN) so that it allows this pin to monitor added power supply. This feature enables output to maintain the state of detection even when voltage of the monitored power supply drops to 0V. The output configuration is N-channel open-drain.
APPLICATIONS
Microprocessor reset circuitry Charge voltage monitors Memory battery back-up switch circuits Power failure detection circuits
FEATURES
High Accuracy Low Power Consumption Detect Voltage Range 2(Detect Voltage1.5V) 30mV(Detect Voltage1.5V) 1.7A (TYP) (VOUT1=1.5V, VOUT2=3.3V, VIN=4.0V) Channel1Sensing pin:VSEN, Output pin:VOUT1) 0.8V5.0V (0.1V increments) Channel2 (Sensing pin:VIN,Output pin: VOUT2) 1.1V5.0V (0.1V increments) Operating Voltage Range 1.0V6.0V 100ppm/(TYP.) Output Configuration N-channel open drain -4085 Built-In 2 Detect Voltage Circuit Separated Sense Pin Package Environmentally Friendly Channel1Sensing pin:VSEN, Output pin:VOUT1) SOT-25 EU RoHS Compliant, Pb Free Operating Temperature Range Detect Voltage Temperature Characteristics
TYPICAL APPLICATION CIRCUIT
R=100k R=100k
VOUT2 VSS VOUT1
VIN
4
Power
VSEN
Monitoring
5
Supply
SOT-25 (TOP VIEW)
1
2
3
1/13
XCM410 Series
PIN CONFIGURATION
VSEN
5
VIN
4
5:VSEN
4:VIN
XC6108
XC6109
1
2
3
VOUT1
VSS SOT-25 (TOP VIEW)
VOUT2
1:VOUT1
2:VSS
3:VOUT2
PIN ASSIGNMENT
PIN 1 2 3 4 5 XCM410 VOUT1 VSS VOUT2 VIN VSEN FUNCTION Output 1 Ground Output 2 Input Voltage Sense
XC6108 VOUT VSS VIN VSEN XC6109 VSS VOUT VIN -
PRODUCT CLASSIFICATION
Ordering Information
XCM410-(*1) DESIGNATOR DESCRIPTION Output Configuration Detect Voltage SYMBOL AA 01 MR MR-G DESCRIPTION VOUT1/VOUT2N-ch open drain output Sequential numbers for two voltage detect combinations VDF1 Detect Voltage Range0.8V 5.0V (0.1V increments) VDF2 Detect Voltage Range1.1V 5.0V (0.1V increments) SOT-25 SOT-25
-
(*1) (*2)
Packages Taping Type (*2)
The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L-)
DESIGNATOR Detect Voltage VDF1 01 1.5 VDF2 3.3
*This series are semi-custom products.
For other combinations, output voltages and etc., please ask Torex sales contacts.
2/13
XCM410
Series
BLOCK DIAGRAM
VIN
each block
VSEN VOUT1
Vref
VOUT2
Vref
each block
VSS
ABSOLUTE MAXIMUM RATINGS
PARAMETER Input Voltage Nch Open Drain Output Voltage Nch Open Drain Sense Pin Voltage Output Current Power Dissipation SOT-25 SYMBOL VIN VOUT1 VOUT2 VSEN IOUT1 IOUT2 Pd Ta Tstg RATINGS VSS-0.37.0 VSS-0.37.0 VSS-0.37.0 VSS-0.37.0 10 10 250 -40+85 -55+125 UNITS V V V mA mA mW
o o
Operating Temperature Range Storage Temperature Range
C C
3/13
XCM410 Series
ELECTRICAL CHARACTERISTICS
XCM410AA Series PARAMETER Operating Voltage Detect Voltage 1 Detect Voltage 2
(*1) (*2) (*2)
SYMBOL VIN VDF1 VDF2 VHYS1 VHYS2
CONDITIONS
MIN. 1
TYP.
MAX. 6
UNITS V V V
CIRCUIT
E-1 E-1 VIN=1.06.0V VDF2(T)=1.15.0V VIN=VDF2x0.9 VSEN=VDF1x0.9
(*3)
Hysteresis Width 1 Hysteresis Width 2
VDF1 X0.02 VDF2 X0.02
VDF1 X0.05 VDF2 X0.05
VDF1 X0.08 VDF2 X0.08
V V
Supply Current 1
(*4)
ISS1
VDF2(T)=1.1V1.9V VDF2(T)=2.0V3.9V VDF2(T)=4.0V5.0V VIN=VDF2x1.1 VSEN=VDF1x1.1
1.4 1.5 1.6
3.3 3.5 3.6
A
Supply Current 2
(*4)
ISS2
VDF2(T)=1.1V1.9V VDF2(T)=2.0V3.9V VDF2(T)=4.0V5.0V VSEN=0V VDS=0.5V(N-ch) VIN=1.0V VIN=2.0V 0.1 0.8 1.2 1.6 1.8 1.9 0.1 0.8 1.2 1.6
1.8 2.0 3.1 0.7 1.6 2.0 2.3 2.4 2.5 0.7 1.6 2.0 2.3 0.2 0.2
3.6 3.8 4.0
A
Output Current 1
IOUT1
VIN=3.0V VIN=4.0V VIN=5.0V VIN=6.0V VDS=0.5V(N-ch) VIN=1.0V
(*5) (*6) (*7) (*8)
mA
Output Current 2
IOUT2
VIN=2.0V VIN=3.0V VIN=4.0V
mA
N-ch Driver Leakage Current 1 N-ch Driver Leakage Current 2 Temperature Characteristics Detect Delay 1 Detect Delay 2
(*1) (*9)
ILEAK1 ILEAK2 VDF/ TaVDF RSEN tDF1 tDF2 tDR1 tDR2
VIN=6.0V, VSEN=6.0V, VOUT=6.0V VIN=6.0V VOUT=6.0V -40 CTa85 C VSEN=5.0V VIN=0V VIN=6.0V VIN=6.0V1.0V VIN=6.0V VIN=1.0V6.0V
o o
0.4 0.4
A A ppm/ C M
o

100 E-2 30 30 30 30 230 230 200 200
Sense Resistance
(*10) (*11) (*12) (*13)
s s s s
Release Delay 1 Release Delay 2
NOTE: *1: VOUT1VOUT2: same characteristics. *2: The detect voltage range for VDF1 (VOUT1): 0.8V5.0V. The detect voltage range for VDF2 (VOUT2): 1.1V5.0V. *3: The detect voltage for VDF2(T) (VOUT2). *4: Current flowing to the sense resistor is not included. *5: VDF2(T)>1.0V *6: VDF2(T)>2.0V *7: VDF2(T)>3.0V *8: VDF2(T)>4.0V *9: Calculated from current value and voltage values at the both ends of the resistor. *10: Time until VSEN=VDF1 reaches VOUT1=VINx0.1 when VSEN falls. *11: Time until VIN=VDF2 reaches VOUT2=0.6V when VIN falls. *12: Time until VSEN=VDF1+VHYS1 reaches VOUT1=VIN when VSEN rises. *13: Time until VIN=VDF2+VHYS2 reaches VOUT2=5.4V when VIN rises.
4/13
XCM410
Series
VOLTAGE CHART
E-1 PARAMETER NOMINAL DETECT VOLTAGE VDF1(T),VDF2(T) (V) 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 DETECT VOLTAGE (V) VDF1,VDF2 MIN. 0.770 0.870 0.970 1.070 1.170 1.270 1.370 1.470 1.568 1.666 1.764 1.862 1.960 2.058 2.156 2.254 2.352 2.450 2.548 2.646 2.744 2.842 2.940 3.038 3.136 3.234 3.332 3.430 3.528 3.626 3.724 3.822 3.920 4.018 4.116 4.214 4.312 4.410 4.508 4.606 4.704 4.802 4.900 MAX. 0.830 0.930 1.030 1.130 1.230 1.330 1.430 1.530 1.632 1.734 1.836 1.938 2.040 2.142 2.244 2.346 2.448 2.550 2.652 2.754 2.856 2.958 3.060 3.162 3.264 3.366 3.468 3.570 3.672 3.774 3.876 3.978 4.080 4.182 4.284 4.386 4.488 4.590 4.692 4.794 4.896 4.998 5.100 MIN.
(*1)
E-2 SENSE RESISTANCE (M) RSEN TYP.
10
20
13
24
15
28
(*1) When VDF1(T),VDF2(T)1.4V, detect accuracy is 30mV. When VDF1(T),VDF2(T)1.5V, detect accuracy is 2%.
5/13
XCM410 Series
OPERATIONAL EXPLANATION
Figure1 is typical application circuit, and Fifure2 is timing chart of figure1.
Figure 1: Typical application circuit example
Input Voltage: VIN Release Voltage: VDF2+VHYS2 Detect Voltage: VDF2 Minimum Operation Voltage: 1.0V Sense Pin Voltage: VSEN Release Voltage: VDF1+VHYS1 Detect Voltage: VDF1
Output Voltage: VOUT1
Output Voltage: VOUT2
Figure 2: The timing chart of Figure 1
As an early state, the VIN power supply pin and the VSEN sense pin are applied sufficiently high voltage (6.0V MAX.). While the sense pin voltage VSEN starts dropping to the detect voltage VDF1 (VSEN>VDF1), the output voltage VOUT1 keeps high level (=VIN). * If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the high level will be a voltage value where the pull-up resistor is connected.
When the sense pin voltage keeps dropping and becomes equal to the detect voltage (VSEN =VDF1), the output voltage changes into the low level (VINx0.1). The detect delay time tDF1 is defined as time which ranges from VSEN=VDF1 to the VOUT1 goes in low level.
The output voltage (VOUT1) maintains low level while the sense pin voltage increases again to reach the release voltage (VSEN< VDF1 +VHYS1). The release delay time tDR1 is defined as time which ranges from sense pin voltage reaches release voltage (VSEN VDF1+VHYS1) to the VOUT1 goes in high level.
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XCM410
Series
OPERATIONAL EXPLANATION (Continued)
The output voltage VOUT1 maintains high level (=VIN) while the sense pin voltage more than detect voltage (VSEN>VDF1). The VIN input voltage pin is applied sufficiently high voltage to the release voltage (VDF2+VHYS2). While the input pin voltage VIN starts dropping to the detect voltage VDF2 (VIN > VDF2), the output voltage VOUT2 keeps high level (=VIN). * If a pull-up resistor of the N-ch open drain is connected to added power supply different from the input voltage pin, the high level will be a voltage value where the pull-up resistor is connected. When the input pin voltage keeps dropping and becomes equal to the detect voltage (VIN = VDF2), the output voltage changes into low level (VINx0.1). The detect delay time tDF2 is defined as time which ranges from VIN =VDF to the VOUT goes in low level. While the input pin voltage keeps below the detect voltage VDF2, and 1.0V or more, the output voltage VOUT2 maintains low level. While the input pin voltage drops to 1.0V or less and it increases again to 1.0V or more, the output voltage (VOUT2) may not be able to maintain low level. Such an operation is called "Undefined Operation", and the output voltage from the VOUT2 pin is called undefined operating voltage VUNS. While the input pin voltage increases from 1.0V to the release voltage level (VINVDF2 +VHYS2), the output voltage (VOUT2) maintains low level. The release delay time tDR2 is defined as time which ranges from the VIN power supply voltage pin reaches release voltage (VINVDF2+VHYS2) to the VOUT2 goes in high level. The output voltage VOUT2 maintains high level (=VIN) while the power supply voltage more than detect voltage (VIN>VDF2). If a pull-up resistor Rpull1 of the N-ch open drain is connected to power supply VIN, output voltage VOUT1 becomes same to the input voltage VIN. While the VIN power supply voltage drops below 1.0V and increases again to 1.0V or more, the output voltage VOUT2 may not be able to maintain low level.
7/13
XCM410 Series
NOTE ON USE
1. Use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent
damage to the device.
2. The power supply input pin voltage drops by the resistance between power supply and the VIN pin, and by through current
at operation of the IC. At this time, the IC may go into malfunction if the power supply input pin voltage falls below the minimum operating voltage range. 3. When the sense voltage is less than 1.0V, be sure to separate the VIN pin and the sense pin, and to apply the voltage over 1.0V to the VIN pin. 4. Note that a rapid and high fluctuation at the power supply input pin voltage may cause a wrong operation. 5. In N channel open drain output, VOUT voltages at detect and release are determined by resistance of a pull-up resistor connected at the VOUT pin. Please choose proper resistance values with referring to Figure 3; During detectionVOUT=Vpull / (1+Rpull / RON) VpullPull-up voltage RON(*1)On-resistance of N channel driver M3 can be calculated as VDS / IOUT1 from electrical characteristics, For example, when (*2) RON = 0.5 / 0.8x10-3 = 625MIN.at VIN=2.0V, Vpull = 3.0V and VOUT 0.1V at detect, Rpull= (Vpull /VOUT-1)xRON= (3 / 0.1-1)x62518 In this case, Rpull should be selected higher or equal to 18k in order to keep the output voltage less than 0.1V during detection. (*1) VIN is smaller RON is bigger, be noted. (*2) For calculation, minimum VIN should be chosen among the input voltage range. During releasingVOUT = Vpull / (1 + Rpull / ROFF) VpullPull-up voltage ROFFOn-resistance of N channel driver M3 is 15MMIN.when the driver is off (as to VOUT / ILEAK) For examplewhen Vpull = 6.0V and VOUT 5.99V, Rpull = (Vpull / VOUT-1)xRoff = (6/5.99-1)x15x106 25 k In this case, Rpull should be selected smaller or equal to 25 k in order to obtain output voltage higher than 5.99V during releasing.
NOTE: Roff=VOUT/ILEAK Figure 3: Test Circuit
8/13
XCM410
Series
TEST CIRCUITS
Circuit Circuit
Circuit
Circuit
Circuit
Circuit
Circuit
Waveform Measurement Point
Waveform Measurement Point
Waveform
Waveform
Circuit
Waveform Measurement Point
Waveform
Waveform Measurement Point
Waveform
9/13
XCM410 Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1)Detect Voltage vs. Ambient Temperature
XC6108C25AGR
VIN=4.0V 2.55
2.55
(2)Detect Voltage vs. Input Voltage
XC6108C25AGR
Detect Voltage: VDF (V)
Detect Voltage: VDF (V)
Ta=25 85 2.50
2.50
-40 2.45
2.45 -50 -25 0 25 50 75 100
1.0
2.0
3.0
4.0
5.0
6.0
Ambient Temperature: Ta ()
Supply Voltage: VIN (V)
(3)Hysteresis Voltage vs. Ambient Temperature
(4)Output Voltage vs. Sense Voltage
XC6108C25AGR
VIN=4.0V 0.20
XC6108C25AGR
Ta=25
Output Voltage: VOUT (V)
7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 -1.0 0 1 2 3 4 5 6 1.0V 4.0V VIN=6.0V
Hysteresis Voltage: VHYS (V)
0.15
0.10
0.05 -50 -25 0 25 50 75 100
Ambient Temperature: Ta ()
Sense Voltage: VSEN (V)
(5)Output Voltage vs. Input Voltage
(6)Output Current vs. Input Voltage
XC6108N25AGR
VSEN=VIN Pull-up=VIN R=100k
XC6108C25AGR
VDS(Nch)=0.5V 4.0
Output V oltage: V OUT (V )
Output Current: Iout (mA)
4.0 3.0 Ta=85 2.0 25 1.0 -40 0.0 -1.0 0 0.5 1 1.5 2 2.5 3
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2
Ta=-40 25
85
3
4
5
6
Supply Voltage: VIN (V)
Supply Voltage: VIN (V)
10/13
XCM410
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7)Leak Current vs. Ambient Temperature
XC6108N25AGR
VIN=VSEN=6.0V VOUT=6.0V
(8)Leak Current vs. Output Voltage
XC6108N25AGR
VIN=VSEN=6.0V
0.20
Leak Carrent: ILE A K ( A )
-50 -25 0 25 50 75 100
Leak Carrent: ILE A K ( A )
0.25
0.25
0.20
0.15
0.15
0.10
0.10 0 1 2 3 4 5 6
Ambient Temperature: Ta ( )
Supply Voltage: VOUT (V)
11/13
XCM410 Series
PACKAGING INFORMATION
SOT-25
*The side of pins are not gilded, but nickel is used: Sn 515m
SOT-25 Reference Pattern Layout
12/13
XCM410
Series
1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.
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